专利名称：Structure and process of via chain for
misalignment test
发明人：Chi-Long Chung,Eddie Chiu,Chun-Lin
Chen,Sheng-Fen Chiu
申请号：US09710624申请日：20001110公开号：US06459151B1公开日：20021001
专利附图：
摘要：A structure or a process of the via chain is employed to test the misalignment.The structure of the via chain includes a first via chain in the first direction and a second
via chain in the second direction. Using the structure having the via chains in two differentdirections, the misalignment can be easily detected.
申请人：PROMOS TECHNOLOGIES INC.
代理机构：MacPherson Kwok Chen & Heid LLP
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