Electrical modules and modular electronic building

专利名称：Electrical modules and modular electronic

building systems

发明人：Jian Hu,Kejia Pan,Zhenshan Wang,Xi Li,Bin

Feng

申请号：US15066903申请日：20160310公开号：US09980405B2公开日：20180522

专利附图：

摘要：The present disclosure provides an electrical module and a modular buildingsystem including electrical modules. The electrical module includes a housing member

including N pin portions and a connecting portion that connects the N pin portions, whereN is greater than 1; N conduction members unconnected with each other; and N magneticmembers. Each pin portion is a plate having a through-hole towards its thicknessdirection, and corresponds to one conduction member and one magnetic member. Eachconduction member includes: a first part electrically connected with a lead of anelectrical component; and a second part electrically connected with the correspondingmagnetic member. Each magnetic member fills the through-hole of the correspondingpin portion, and establishes magnetic connection with a magnetic member of anotherelectrical module in thickness direction to allow the two electrical modules to contactand rotate against each other using a contacting point as a rotation pivot.

申请人：Microduino Inc.,Meike Technology (Beijing) Ltd.

地址：Westlake Village CA US,Beijing CN

国籍：US,CN

代理机构：Anova Law Group, PLLC

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