HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURI

专利名称：HEAT-RADIATING SUBSTRATE AND

METHOD OF MANUFACTURING THE SAME

发明人：Chang Hyun LIM,Jung Eun KANG,Seog Moon

CHOI,Kwang Soo KIM,Joon Seok CHAE,SungKeun PARK

申请号：US12911620申请日：20101025

公开号：US20110303437A1公开日：20111215

专利附图：

摘要：Disclosed herein are a heat-radiating substrate and a method of manufacturing

the same. The heat-radiating substrate includes a core layer including a core metal layerand a core insulating layer formed on the core metal layer and divided into a first regionand a second region; a circuit layer formed in the first region of the core layer; and abuild-up layer formed in the second region of the core layer and including a build-upinsulating layer and a build-up circuit layer. A heat generating element is mounted on thecircuit layer and a thermally weakened element is mounted on the build-up layer,thereby preventing the thermally weakened element from being damaged by the heatgenerated from the heat generating element.

申请人：Chang Hyun LIM,Jung Eun KANG,Seog Moon CHOI,Kwang Soo KIM,Joon SeokCHAE,Sung Keun PARK

地址：Seoul KR,Gyunggi-do KR,Seoul KR,Gyunggi-do KR,Gyunggi-do KR,Gyunggi-do KR

国籍：KR,KR,KR,KR,KR,KR

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