专利名称：Master slice semiconductor device发明人：omokazu Araki申请号：US07/819666申请日：19920113公开号：US05194931A公开日：19930316
摘要：A bonding pad to be bonded to a lead electrode is formed to have an openingwith a substantially square plane shape, and a bonding pad which is not to be bonded toa lead electrode is formed to have an opening with a substantially square plane shapewith a notched position in the center. The outer shapes of the electrode pads are variedin accordance with packages which contain semiconductor chip.
申请人：KABUSHIKI KAISHA TOSHIBA
代理机构：Finnegan, Henderson, Farabow, Garrett and Dunner
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