专利名称：INTEGRATED CIRCUIT PACKAGE
EMPLOYING PREDETERMINED THREE-DIMENSIONAL SOLDER PAD SURFACE ANDMETHOD FOR MAKING SAME
发明人：Adam R. Zbrzezny,Roden R. Topacio申请号：US12194265申请日：20080819
公开号：US20100044884A1公开日：20100225
专利附图：
摘要：An integrated circuit package employs a solder pad that includes a
predetermined three dimensional surface that is adapted to receive solder. In oneexample, the predetermined three dimensional surface includes at least one
predetermined hill or protruding portion and a valley portion, such as a lower portion,having a predetermined relative height between the hill portion and a valley portion. Thepredetermined three dimensional surface can be configured in any suitable configurationand may include contoured patterns, non-patterns, or any other suitable configuration asdesired. A related method is also described.
申请人：Adam R. Zbrzezny,Roden R. Topacio
地址：Scarborough CA,Markham CA
国籍：CA,CA
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